After more than a century of history and fifty years of innovation in the packaging machinery sector, Concetti S.p.A. announces a new phase in its growth journey, marked by a governance transition that combines continuity with renewal. With the designation of Emanuele and Riccardo Concetti as Chief Executive Officers, the fourth generation of the family reaffirms its commitment to leading the company. This step blends strong roots with a forward-looking vision, with the aim of strengthening the group’s international positioning.
Toscotec will attend Tissue World Miami 2026, taking place from April 22 to 24 at the Miami Beach Convention Center. As one of the world’s largest trade shows focusing exclusively on the tissue industry, this gathering offers an unparalleled opportunity to connect, learn, and cooperate across the entire tissue value chain.
Together with its partner company, emtec Electronic North Amercia, the German company emtec Electronic GmbH will present its technical innovations for process optimization to all interested visitors at TappiCon 2026 in Columbus, Ohio. In addition, emtec will participate in the panel discussion “Tissue Softness Workshop” on the final day of the event.
Royal Geostick Group has purchased a new Bobst Master M5 flexo press, purpose-built for the high-volume multilayer label production that its customers increasingly demand. Configured with 12 flexo units, a double unwinder, QN module and oneECG-readiness, the Master M5 press will shortly be installed at Royal Geostick’s facility in Uithoorn, Netherlands, where it will strengthen the company’s ability to deliver efficient, sustainable production for medium and long-run label applications.
Spinnova’s plans to restart production at Woodspin’s demo factory are progressing. Trial runs will be started at the demo factory, with a particular focus on improving production efficiency. Most of the technological solutions to be tested during the trial runs have already been proven to work at a smaller pilot scale. Based on the results achieved in the trial runs, the company’s goal is to restart production on a larger scale during 2026.
Toscotec will participate in the 33rd edition of the China International Disposable Paper Expo, CIDPEX, taking place in Nanjing, China, from April 15 to 17, 2026. As one of the world’s largest exhibitions dedicated to tissue and disposable hygiene products, this event offers an exceptional platform for Toscotec to engage with one of the most vibrant and fast-evolving markets in the industry.
Following the contract announced in 2025, Voith has successfully started up PM 19 at Wuzhou Specialty Paper. The paper machine is the first worldwide to operate with Voith’s DuoCentri NipcoFlex press with center belt. The solution has now moved from development to commercial opera-tion and has already demonstrated stable production and reliable web runnability.
Heidelberger Druckmaschinen AG (Heidelberg) draws a very positive conclusion from its participation in Expoprint & Converflexo Latin America 2026, which took place from March 24 to 28 in São Paulo, Brazil. With an order volume of over 30 million euros generated at the trade show, the event’s success exceeded expectations. Overall, order intake in the region—and particularly in Brazil—continues to rise, offering significant growth potential for the company.
Durst Group has appointed Wolfgang Knotz as Chief Technology Officer (CTO) of the Group, effective April 1, 2026. With this decision, the company underscores its commitment – on the occasion of its 90th anniversary – to consistently drive its transformation from a machine manufacturer to a technology-driven solutions provider.
For the first time in years, emtec Electronic will be attending this year´s CIDPEX China International Disposable Paper Expo from April 15 to 17. Together with its long-standing partner Hu Yuntao from Shanghai Forest & Paper Scientific Instrument at booth 8J08, the company will present its latest testing solutions for zeta potential and softness analysis at the world´s largest exhibition for paper and nonwoven hygiene products.
Valmet introduces Valmet IQ Virtual Sensor, a software-based solution that gives paper and board producers real-time visibility of critical end-product strength properties that have traditionally been measured only in the laboratory. By providing continuous quality predictions, the solution enables mills to maintain consistent quality, reduce fiber and starch costs, decrease energy consumption, and increase overall production efficiency.
UPM Adhesive Materials will expand its footprint in India with a new slitting and distribution terminal near New Delhi. The investment enhances UPM Adhesive Materials’ service capability in Northern and Eastern India and reinforces its commitment to the entire Indian market.