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Spinnova begins trial runs at Woodspin demo factory
Spinnova’s plans to restart production at Woodspin’s demo factory are progressing. Trial runs will be started at the demo factory, with a particular focus on improving production efficiency. Most of the technological solutions to be tested during the trial runs have already been proven to work at a smaller pilot scale. Based on the results achieved in the trial runs, the company’s goal is to restart production on a larger scale during 2026.
Toscotec to exhibit at CIDPEX 2026 in Nanjing
Toscotec will participate in the 33rd edition of the China International Disposable Paper Expo, CIDPEX, taking place in Nanjing, China, from April 15 to 17, 2026. As one of the world’s largest exhibitions dedicated to tissue and disposable hygiene products, this event offers an exceptional platform for Toscotec to engage with one of the most vibrant and fast-evolving markets in the industry.
Voith and Wuzhou Specialty Paper successfully start up first DuoCentri NipcoFlex press with center belt
Following the contract announced in 2025, Voith has successfully started up PM 19 at Wuzhou Specialty Paper. The paper machine is the first worldwide to operate with Voith’s DuoCentri NipcoFlex press with center belt. The solution has now moved from development to commercial opera-tion and has already demonstrated stable production and reliable web runnability.
Strong trade show results: HEIDELBERG impresses at Expoprint 2026 in Brazil
Heidelberger Druckmaschinen AG (Heidelberg) draws a very positive conclusion from its participation in Expoprint & Converflexo Latin America 2026, which took place from March 24 to 28 in São Paulo, Brazil. With an order volume of over 30 million euros generated at the trade show, the event’s success exceeded expectations. Overall, order intake in the region—and particularly in Brazil—continues to rise, offering significant growth potential for the company.
Durst Group appoints Wolfgang Knotz as Chief Technology Officer (CTO)
Durst Group has appointed Wolfgang Knotz as Chief Technology Officer (CTO) of the Group, effective April 1, 2026. With this decision, the company underscores its commitment – on the occasion of its 90th anniversary – to consistently drive its transformation from a machine manufacturer to a technology-driven solutions provider.
Emtec Electronic at CIDPEX 2026
For the first time in years, emtec Electronic will be attending this year´s CIDPEX China International Disposable Paper Expo from April 15 to 17. Together with its long-standing partner Hu Yuntao from Shanghai Forest & Paper Scientific Instrument at booth 8J08, the company will present its latest testing solutions for zeta potential and softness analysis at the world´s largest exhibition for paper and nonwoven hygiene products.
Valmet launches IQ Virtual Sensor
Valmet introduces Valmet IQ Virtual Sensor, a software-based solution that gives paper and board producers real-time visibility of critical end-product strength properties that have traditionally been measured only in the laboratory. By providing continuous quality predictions, the solution enables mills to maintain consistent quality, reduce fiber and starch costs, decrease energy consumption, and increase overall production efficiency.
UPM strengthens presence in India with a new Adhesive Materials terminal near New Delhi
UPM Adhesive Materials will expand its footprint in India with a new slitting and distribution terminal near New Delhi. The investment enhances UPM Adhesive Materials’ service capability in Northern and Eastern India and reinforces its commitment to the entire Indian market.
Mondi reveals how purpose-built corrugated packaging can reduce food waste
Mondi has released a new white paper exploring how fit-for-purpose packaging can help food producers and retailers protect product quality and reduce waste across increasingly demanding supply chains. The paper - ‘Turning Packaging into a Competitive Advantage in the Food Supply Chain’ - shows that handling pressures and packaging performance challenges in today’s complex supply chains can lead to product loss, disruption and brand damage.
Heidelberg aims to expand its presence in the dynamic Latin American region
Latin America is increasingly coming into focus as a growth region for the printing and packaging industry, alongside markets in Asia. With a population of around 670 million, the region is home to approximately eight percent of the world’s population, half of whom live in Mexico and Brazil alone—the two largest and most dynamic economies in the region. With projected gross domestic product (GDP) growth of around two and three percent, respectively, over the next few years, these countries are demonstrating stable economic development. Increasing prosperity, combined with a more urban lifestyle, is also driving up demand for printed packaging solutions.
InterPack
Bobst unites with industry partners at Interpack 2026
Bobst aims to make an impact at Interpack 2026 in Düsseldorf, Germany, from May 7-13, through a coordinated program of partner collaborations, joint presentations, demonstrations and events. Spanning labels, flexible packaging, folding cartons and corrugated board, Bobst intends to highlight the future of packaging production.
Sappi Europe announces additional price increase for Packaging & Speciality products effective 15 April 2026
Following Sappi’s recent price increase communications for Packaging & Speciality products effective 1 April 2026, they are announcing further necessary pricing adjustments.
